Our company has been established since 1974, >40 years ago in South Korea. Today we have 6 factories, 500 employees with a sales of US$600M (2015).
We started ISO9001 certified Gold Bonding Wire business in 1996, over the years, we expanded into gold, copper, silver and alloy bonding wires.
We have developed Silver Bonding Wire as a perfect combination of significant cost reduction compared to Gold and required bonding features for sensitive devices. Silver Bonding Wire can achieve good reliability and excellent bondability whenever dies have sensitive or thin bond pads in which copper could damage the chip in the bonding process. Being soft enough for sensitive materials, silver as a cost effective material is a good alternative to gold in such a case.
The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for ultra-fine pitch bonding & high-powered applications. Our Silver Bonding Wire continue to serve the packaging material market for decades through our continuous improving R&D effort.
The analysts forecast the global bonding wire packaging material market will generate revenues of USD 2.9 billion in 2020.
Below is the general reference of specifications of Gold Bonding Wire and its application/feature for replacement by Silver Bonding Wire:
Typical special GOLD Bonding Wire is good for below applications:
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